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Thick copper plate process solution
Product Introduction and Process Features
Thick copper plates are mainly high current substrates, which are generally high-power or high-voltage substrates. They are commonly used in automotive electronics, communication equipment, aerospace, network energy, planar transformers, power converters, and secondary power modules. The development of thinness and miniaturization in electronic products urgently requires PCBs to have higher thermal conductivity, and the application of thin core thick copper multilayer boards is more widespread. The advantages of thick copper: Thick copper plates (≥ 3oz) have the ability to carry large currents, reduce thermal strain, and have good heat dissipation.
Characteristics of Thick Copper Process
Etching usually involves etching twice
Special pressing program for pressing
Special resin filling treatment is required for 8oz or above (inclusive)
Welding prevention requirements
Line Mask Design
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