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Accumulated rich experience in the research and production of high-precision, high-density, and high reliability printed circuit boards


Thick copper plate process solution

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Product Introduction and Process Features

Thick copper plates are mainly high current substrates, which are generally high-power or high-voltage substrates. They are commonly used in automotive electronics, communication equipment, aerospace, network energy, planar transformers, power converters, and secondary power modules. The development of thinness and miniaturization in electronic products urgently requires PCBs to have higher thermal conductivity, and the application of thin core thick copper multilayer boards is more widespread. The advantages of thick copper: Thick copper plates (≥ 3oz) have the ability to carry large currents, reduce thermal strain, and have good heat dissipation.


Characteristics of Thick Copper Process

Etching usually involves etching twice

Special pressing program for pressing

Special resin filling treatment is required for 8oz or above (inclusive)

Welding prevention requirements

Line Mask Design

Jiangxi Business Department:

Tel:+86 0796 8616 983

Address: No. 1, Yongjin Avenue, Jinggangshan Economic and Technological Development Zone, Ji'an City, Jiangxi Province

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Address: No. 116, Jianshe Road, Longyuan Industrial Park, Mabei Town, Boluo County, Huizhou City, Guangdong Province

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